3D Microelectronic Packaging: From Fundamentals to Applications (Springer Series in Advanced Microelectronics, Band 57) | DealShopping Deutschland

3D Microelectronic Packaging: From Fundamentals to Applications (Springer Series in Advanced Microelectronics, Band 57)

~~192.59 EUR~~ 173.94 EUR 10% Off

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3D Microelectronic Packaging: From Fundamentals to Applications (Springer Series in Advanced Microelectronics, Band 57)

Medimops DE

173.94 EUR

14-05-2026 17:12:17

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3D Microelectronic Packaging

SpringerLink DE

192.59 EUR

14-05-2026 15:20:33

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3D Microelectronic Packaging, Fachbücher von Yan Li, Deepak Goyal

Galaxus.de

192.59 EUR

14-05-2026 09:47:12