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Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces

53.49 EUR

Ein Fachbuch, das die Mikrostruktur und mechanische Stabilität von Kupfer‑/Bleifreien Lötverbindungen analysiert, neue Erkenntnisse zu Korrosion, Wärmeausdehnung und Optimierung liefert.

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