Tong, Xingcun Colin: Advanced Materials for Thermal Management of Electronic Packaging
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Gesponsert
Medimops DE
Advanced Materials for Thermal Management of Electronic Packaging (Springer Series in Advanced Microelectronics, 30, Band 30)
Medimops DE
25-05-2026 18:34:56
Gesponsert
SpringerLink DE
Advanced Materials for Thermal Management of Electronic Packaging
SpringerLink DE
25-05-2026 10:19:45
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