Materials, Processes and Reliability for Advanced Interconnects for Micro and Nanoelectronics - 2009: Volume 1156

39.00 EUR

Dieses Fachbuch beleuchtet innovative Verbindungstechniken in Mikro‑ und Nanoelektronik: neue Werkstoffe, präzise Fertigungsverfahren und robuste Zuverlässigkeitsanalysen für die nächste Generation von Halbleiterbauteilen.

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Materials, Processes and Reliability for Advanced Interconnects for Micro and Nanoelectronics - 2009: Volume 1156 (MRS Proceedings)

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39.00 EUR

27-04-2026 09:49:17

Materials, Processes and Reliability for Advanced Interconnects for Micro and Nanoelectronics - 2009: Volume 1156

Materials, Processes and Reliability for Advanced Interconnects for Micro and Nanoelectronics - 2009: Volume 1156 (MRS Proceedings)

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